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Pin grid arrays. Final report
Author(s) -
D.R. Obenland
Publication year - 1993
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/10167083
Subject(s) - rework , grid , soldering , electronic packaging , computer science , ball grid array , partitioned global address space , embedded system , materials science , electrical engineering , engineering , operating system , composite material , geology , geodesy , scalability

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