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Capillary flow solderability test for printed wiring boards
Author(s) -
F.M. Hosking,
F.G. Yost,
C.L. Hernandez,
S.J. Sackinger
Publication year - 1994
Language(s) - English
Resource type - Reports
DOI - 10.2172/10144014
Subject(s) - solderability , soldering , printed circuit board , surface mount technology , capillary action , flow (mathematics) , conductor , materials science , solder paste , wave soldering , test (biology) , engineering drawing , mechanical engineering , engineering , electrical engineering , metallurgy , composite material , geology , mechanics , physics , paleontology

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