Open AccessThe role of grain boundaries on the strength, ductility and toughness of Ll{sub 2} intermetallic compounds. Progress report on year 2, March 17, 1987--March 11, 1988
Author(s) -
E. M. Schulson
Publication year - 1988
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/10120970
Subject(s) - intermetallic , ductility (earth science) , toughness , grain boundary , materials science , dopant , metallurgy , engineering physics , engineering , microstructure , doping , optoelectronics , creep , alloy
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