Thermal-stress modeling of an optical microphone at high temperature. | Zendy

Casey Barnard | Zendy

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Thermal-stress modeling of an optical microphone at high temperature.

Author(s) -

Casey Barnard

Publication year - 2010

Language(s) - English

Resource type - Reports

DOI - 10.2172/1005061

Subject(s) - thermal expansion , materials science , microphone , thermal , microelectromechanical systems , stress (linguistics) , deformation (meteorology) , range (aeronautics) , atmospheric temperature range , composite material , acoustics , optoelectronics , thermodynamics , physics , linguistics , philosophy , sound pressure

To help determine the capability range of a MEMS optical microphone design in harsh conditions computer simulations were carried out. Thermal stress modeling was performed up to temperatures of 1000 C. Particular concern was over stress and strain profiles due to the coefficient of thermal expansion mismatch between the polysilicon device and alumina packaging. Preliminary results with simplified models indicate acceptable levels of deformation within the device

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