Open AccessElectromagnetic Environmental Effects Modeling of Advanced Packaged Modules.
Author(s) -
D. J. Kenneally
Publication year - 1995
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.21236/ada304608
Subject(s) - boundary scan , testability , test (biology) , electronic circuit , electronic engineering , embedding , electromagnetic environment , design for testing , computer science , digital electronics , engineering , electrical engineering , integrated circuit , computer hardware , embedded system , reliability engineering , artificial intelligence , geology , paleontology
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