Open AccessMultichip Technology - A Method of Increasing the Packing Density While Simultaneously Decreasing the Assembly Expense
Author(s) -
H. J. Hanke
Publication year - 1976
Language(s) - English
Resource type - Reports
DOI - 10.21236/ada039070
Subject(s) - sphere packing , process engineering , computer science , materials science , engineering , composite material
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