Open AccessDesign and Implementation of Solder Paste Dispenser Based on Linear Drive System
Author(s) -
Riky Tri Yunardi,
Moh. Zakky Zulfiar,
Rr. Wanda Auruma Putri,
Deny Arifianto
Publication year - 2019
Publication title -
jeee-u (journal of electrical and electronic engineering-umsida)
Language(s) - English
Resource type - Journals
eISSN - 2540-8658
pISSN - 2460-9250
DOI - 10.21070/jeee-u.v3i2.2637
Subject(s) - solder paste , printed circuit board , soldering , surface mount technology , resistor , wave soldering , electronics , electronic component , materials science , nozzle , mechanical engineering , electrical engineering , engineering , voltage , composite material
In the technology to create prototypes for electronic hardware is usually constructed using surface mount device printed circuit board (SMD PCB). In this paper introduces the design and implementation of low-cost electrical solder paste dispenser that supports the PCB solder process. The design consists of a nozzle and linear drive systems based on stepper motors operating with electric power to push the plunger down to drop the solder paste on the board. To test the performance of solder paste that has been designed verified by experiment. Solder paste dispenser design was tested using SMD resistor with the solder pads of different sizes for R0603, R0805, and R1206 on PCB. The results showed that the design of the prototype was able to put the pasta in various field pads between 0.54 mm2, 0.91 mm2 and 1.44 mm2 for standard solder pads with an error in the 2% - 5%. Based on the results, the device has been shown to potentially be used to attach electronic components to printed circuit boards.
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