Development of Flexible Inserter for IC Chip Testing | Zendy

Toshihiro Taguchi | Zendy

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Development of Flexible Inserter for IC Chip Testing

Author(s) -

Toshihiro Taguchi

Publication year - 2001

Publication title -

journal of robotics and mechatronics

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.257

H-Index - 19

eISSN - 1883-8049

pISSN - 0915-3942

DOI - 10.20965/jrm.2001.p0289

Subject(s) - economic shortage , throughput , chip , process (computing) , pressing , ball grid array , semiconductor device fabrication , automotive engineering , embedded system , computer science , engineering , manufacturing engineering , reliability engineering , mechanical engineering , electrical engineering , materials science , telecommunications , operating system , linguistics , philosophy , soldering , composite material , government (linguistics) , wafer , wireless

In the last stage of semiconductor manufacturing process, IC is inserted in the testing equipment for many kinds of electrical characteristics test. But the use of position control causes many problems such as shortage or overdose of pressing force, the non-uniformity of pressing force, and the shoulder touch phenomenon of IC pressing etc. Thus the testing process with stable and flexibly efficient handler is desired. In this paper, focusing on IC packages such as BGA and CSP, the development of flexible inserter for IC testing based on force control and with a new passive compliance unit (PCU) is reported to improve testing throughput drastically.

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