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Inspection System of Soldering Joint on Printed Circuit Board by Using Neural Network
Author(s) -
Shunichiro Oe,
Kennichi Kaida,
Daisuke Nagai,
Mituo Nakamura,
Tomohiro Kimura,
Koichi Kameyama
Publication year - 1995
Publication title -
journal of robotics and mechatronics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.257
H-Index - 19
eISSN - 1883-8049
pISSN - 0915-3942
DOI - 10.20965/jrm.1995.p0225
Subject(s) - printed circuit board , soldering , joint (building) , automated optical inspection , artificial neural network , brightness , computer science , artificial intelligence , wave soldering , computer vision , image sensor , image (mathematics) , engineering , materials science , optics , structural engineering , physics , composite material , operating system
This paper deals with a new inspection system of soldering joint on printed circuit board by using neural network. A sensor unit of this system consists of a semiconductor laser unit, four PSDs, and a pin photo-diode. We can obtain four types of images which are called height image, PSD brightness image, vertical image and vector image, by using four sensor units. We extract the features which show the state of soldering joint from these images and develop an inspection system using the neural networks constructed for the features and the state of soldering joint.

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