Potential and Challenges of Diamond Wafer Toward Power Electronics | Zendy

Shinichi Shikata | Zendy

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Potential and Challenges of Diamond Wafer Toward Power Electronics

Author(s) -

Shinichi Shikata

Publication year - 2018

Publication title -

international journal of automation technology

Language(s) - English

Resource type - Journals

eISSN - 1883-8022

pISSN - 1881-7629

DOI - 10.20965/ijat.2018.p0175

Subject(s) - wafer , slicing , diamond , materials science , electronics , engineering physics , semiconductor , dislocation , power electronics , power semiconductor device , machining , nanotechnology , optoelectronics , mechanical engineering , electrical engineering , engineering , metallurgy , composite material , voltage

To achieve a 50% worldwide reduction of CO 2 by the middle of this century, development of energy saving power device technology using wide bandgap materials is urgently needed. Diamond is receiving increasing attention as a next generation material for wide bandgap semiconductors owing to its extreme characteristics. Research studies investigating large wafers, low resistivity, and low dislocation have accelerated. This study targets the use of wafers for power electronics applications, and the required machining technologies for diamond, including wafer shaping, slicing, and surface finishing, are introduced.

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