Micro Imprinting for Al Alloy Using Ni-W Electroformed Mold | Zendy

Manabu Yasui | Zendy; Satoru Kaneko | Zendy; Masaharu Takahashi | Zendy; Takashi Sano | Zendy; Yasuo Hirabayashi | Zendy; Takeshi Ozawa | Zendy; Ryutaro Maeda | Zendy

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Micro Imprinting for Al Alloy Using Ni-W Electroformed Mold

Author(s) -

Manabu Yasui,

Satoru Kaneko,

Masaharu Takahashi,

Takashi Sano,

Yasuo Hirabayashi,

Takeshi Ozawa,

Ryutaro Maeda

Publication year - 2015

Publication title -

international journal of automation technology

Language(s) - English

Resource type - Journals

eISSN - 1883-8022

pISSN - 1881-7629

DOI - 10.20965/ijat.2015.p0674

Subject(s) - electroforming , mold , materials science , intermetallic , alloy , imprinting (psychology) , metallurgy , composite material , layer (electronics) , chemistry , biochemistry , gene

We demonstrate the heat-resistant property of a Ni-W electroformed mold (Ni-W mold) used as the micro imprinting die for an Al alloy. To enhance the transfer performance of the Ni-W mold to A2017, we carried out micro imprinting for A2017 at 600°C. However, entire Ni-W patterns stuck to A2017. It is considered that Al, a major component of A2017, and Ni, a major component of a Ni-W mold, formed an intermetallic compound at 600°C.

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