Full density Cu-Invar composites with high thermal conductivity and low coefficient of thermal expansion fabricated by ultrasonic powder consolidation | Zendy

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Full density Cu-Invar composites with high thermal conductivity and low coefficient of thermal expansion fabricated by ultrasonic powder consolidation

Author(s) -

Ying Wang

Publication year - 2020

Language(s) - English

Resource type - Dissertations/theses

DOI - 10.17760/d20385580

Subject(s) - invar , materials science , thermal expansion , composite material , composite number , thermal conductivity

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