Open AccessFast and scalable interfacial convective assembly of nanoparticles for interconnects applications
Author(s) -
Adnan Korkmaz
Publication year - 2017
Language(s) - English
Resource type - Dissertations/theses
DOI - 10.17760/d20253984
Subject(s) - fluidics , materials science , nanotechnology , electric field , field (mathematics) , mechanical engineering , engineering , electrical engineering , physics , mathematics , quantum mechanics , pure mathematics
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