Open AccessDensification and metallurgical bonding in copper powder compact during ultrasonic powder consolidation
Author(s) -
Zheng Liu
Publication year - 2015
Language(s) - English
Resource type - Dissertations/theses
DOI - 10.17760/d20200338
Subject(s) - materials science , consolidation (business) , metallurgy , ultrasonic sensor , copper , metal powder , powder metallurgy , composite material , ultrasonic testing , sintering , metal , physics , accounting , acoustics , business
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