Open AccessANALYSIS OF THERMAL FIELDS OF PRINTED CIRCUIT ASSEMBLIES
Author(s) -
Rana Gh. Faysal,
Auday Shaker Hadi,
А. Н. Литвинов,
Yakovlevich Bannov Valery
Publication year - 2016
Publication title -
theoretical and applied science
Language(s) - English
Resource type - Journals
eISSN - 2409-0085
pISSN - 2308-4944
DOI - 10.15863/tas.2016.02.34.10
Subject(s) - thermal , materials science , printed circuit board , mechanical engineering , electrical engineering , engineering , physics , meteorology
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