Improving the interface adherence at sealings in solid oxide cell stacks

(11/09/2019) Improving the interface adherence at sealings in solid oxide cell stacks Thermal cycling of planar solid oxide cell (SOC) stacks can lead to failure due to thermal stresses arising from differences in thermal expansion of the stack’s materials. The interfaces between the cell, interconnect, and sealing are particularly critical. Hence, understanding possible failure mechanisms at the interfaces and developing robust sealing concepts are important for stack reliability. In this work, the mechanical performance of interfaces in the sealing region of SOC stacks is studied. Joints comprising Crofer22APU (preoxidized or coated with MnCo2O4 or Al2O3) are sealed using V11 glass. The fracture energy of the joints is measured, and the fractured interfaces are analyzed using microscopy. The results show that choosing the right coating solution would increase the fracture energy of the sealing area by more than 70%. We demonstrate that the test methodology could also be used to test the adhesion of thin coatings on metallic substrates.