Critical Parameters and TCLP Performance of the RFP Microwave Solidification System
Author(s) -
V.G. Eschen,
G.S. Fenner,
DM Splett,
G.S. Sprenger
Publication year - 1996
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Book series
DOI - 10.1520/stp14124s
Subject(s) - microwave , materials science , engineering , telecommunications
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