Residual Thermal and Moisture Influences on the Strain Energy Release Rate Analysis of Edge Delamination | Zendy

KL Reifsnider | Zendy; GP Sendeckyi | Zendy; ShoeiShen Wang | Zendy; TT Chiao | Zendy; William W. Feng | Zendy; W Steven Johnson | Zendy; WW Stinchcomb | Zendy; TK O'Brien | Zendy; IS Raju | Zendy; Donald P. Garber | Zendy

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Residual Thermal and Moisture Influences on the Strain Energy Release Rate Analysis of Edge Delamination

Author(s) -

KL Reifsnider,

GP Sendeckyi,

ShoeiShen Wang,

TT Chiao,

William W. Feng,

W Steven Johnson,

WW Stinchcomb,

TK O'Brien,

IS Raju,

Donald P. Garber

Publication year - 1986

Publication title -

journal of composites technology and research

Language(s) - English

Resource type - Journals

eISSN - 1945-7537

pISSN - 0884-6804

DOI - 10.1520/ctr10320j

Subject(s) - materials science , composite material , strain energy release rate , delamination (geology) , moisture , enhanced data rates for gsm evolution , strain energy , toughness , residual stress , strain rate , fracture toughness , fracture mechanics , finite element method , tension (geology) , residual , structural engineering , ultimate tensile strength , paleontology , telecommunications , algorithm , biology , computer science , subduction , tectonics , engineering

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