Influence of Interface Ply Orientation on Fatigue Damage of Adhesively Bonded Composite Joints
Author(s) -
KL Reifsnider,
GP Sendeckyj,
ShoeiShen Wang,
TT Chiao,
Wei Feng,
W Steven Johnson,
WW Stinchcomb,
WS Johnson,
S. Mall
Publication year - 1986
Publication title -
journal of composites technology and research
Language(s) - English
Resource type - Journals
eISSN - 1945-7537
pISSN - 0884-6804
DOI - 10.1520/ctr10314j
Subject(s) - adhesive , materials science , composite material , epoxy , delamination (geology) , composite number , lap joint , joint (building) , stress (linguistics) , stacking , layer (electronics) , structural engineering , paleontology , linguistics , philosophy , biology , subduction , tectonics , engineering , physics , nuclear magnetic resonance
An experimental study of cracked-lap-shear specimens was conducted to determine the influence of adherend stacking sequence on debond initiation and damage growth in a composite-to-composite bonded joint. Specimens consisted of quasi-isotropic graphite/epoxy adherends bonded together with either FM-300 or EC 3445 adhesives. The stacking sequence of the adherends was varied such that 0 deg, 45 deg, or 90 deg plies were present at the adherend-adhesive interfaces. Fatigue damage initiated in the adhesive layer in those specimens with 0 deg and 45 deg interface plies. Damaage initiated in the form of ply cracking in the strap adherend for the specimens with 90 deg interface plies. The fatigue-damage growth was in the form of delamination within the composite adherends for specimens with the 90 deg and 45 deg plies next to the adhesive, while debonding in the adhesive resulted for the specimens with 0 deg plies next to the adhesive. Those joints with the 0 deg and 45 deg plies next to either adhesive has essentially the same fatigue-damage-initiation stress levels. These stress levels were 13 and 71 percent higher, respectively, than those for specimens with 90 deg plies next to the EC 3445 and FM-300 adhesives.
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom