Open AccessMicrostructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys
Author(s) -
Mohd Mohd Salleh
Publication year - 2016
Publication title -
queensland's institutional digital repository (the university of queensland)
Language(s) - Uncategorized
Resource type - Dissertations/theses
DOI - 10.14264/uql.2016.1141
Subject(s) - microstructure , soldering , materials science , ceramic , sintering , powder metallurgy , composite material , metallurgy , indentation hardness , synchrotron , electronic packaging , physics , nuclear physics
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