z-logo
open-access-imgOpen Access
Scalable 3D dense integration of photonics on bulk silicon
Author(s) -
Nicolás Sherwood-Droz,
Michal Lipson
Publication year - 2011
Publication title -
optics express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.19.017758
Subject(s) - materials science , photonics , optics , extinction ratio , microelectronics , chemical vapor deposition , plasma enhanced chemical vapor deposition , silicon , silicon photonics , optoelectronics , integrated optics , waveguide , annealing (glass) , physics , wavelength , composite material
We experimentally show vertically stacked, multi-layer, low-temperature deposited photonics for integration on processed microelectronics. Waveguides, microrings, and crossings are fabricated out of 400°C PECVD Si3N4 and SiO2 in a two layer configuration. Waveguide losses of ~1 dB/cm in the L-band are demonstrated using standard processing and without post-deposition annealing, along with vertically separated intersections showing -0.04 ± 0.002 dB/cross. Finally 3D drop rings are shown with 25 GHz channels and 24 dB extinction ratio.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom