Open AccessProgress in OCT-based Through Silicon Via (TSV) metrology
Author(s) -
Wolfgang Iff,
J-P. Hugonin,
Christophe Sauvan,
Mondher Besbes,
Pierre Chavel,
Guillaume Vienne,
Laurent Milord,
Dario Alliata,
Étienne Herth,
Philippe Coste,
Alain Bosseboeuf
Publication year - 2019
Publication title -
frontiers in optics + laser science aps/dls
Language(s) - Uncategorized
Resource type - Conference proceedings
DOI - 10.1364/fio.2019.jw4a.115
Subject(s) - through silicon via , optical coherence tomography , stacking , metrology , silicon , interconnection , three dimensional integrated circuit , materials science , computer science , scalar (mathematics) , electronic engineering , optics , optoelectronics , integrated circuit , engineering , physics , telecommunications , geometry , mathematics , nuclear magnetic resonance
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