Evaluation of stresses in flame resistant materials | Zendy

K. Arun Vasantha Geethan | Zendy; São José | Zendy

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Evaluation of stresses in flame resistant materials

Author(s) -

K. Arun Vasantha Geethan,

São José

Publication year - 2010

Publication title -

material science research india

Language(s) - English

Resource type - Journals

eISSN - 2394-0565

pISSN - 0973-3469

DOI - 10.13005/msri/070122

Subject(s) - reliability (semiconductor) , electronic component , soldering , electronics , materials science , electronic packaging , electronic equipment , thermal expansion , thermal shock , electronic systems , accelerated life testing , electric shock , mechanical engineering , reliability engineering , forensic engineering , composite material , engineering , electrical engineering , electronic engineering , psychology , developmental psychology , power (physics) , maturity (psychological) , physics , quantum mechanics

Electronic assemblies utilize a wide variety of plastics and metals in the fabrication and manufacturing of their products. These materials can have significant differences in their thermal TCE, which may result in high strains and stresses in the lead wires, solder joints, and PTH if these factors are not understood or if they are ignored. Temperature changes will produce dimensional changes in almost all materials normally used in the assembly of electronic chassis and PCBs. Dimensional changes can occur due to power cycling where Material Science Research India Vol. 7(1), 179-186 (2010)

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