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Electronic assemblies utilize a wide variety of plastics and metals in the fabrication and manufacturing of their products. These materials can have significant differences in their thermal TCE, which may result in high strains and stresses in the lead wires, solder joints, and PTH if these factors are not understood or if they are ignored. Temperature changes will produce dimensional changes in almost all materials normally used in the assembly of electronic chassis and PCBs. Dimensional changes can occur due to power cycling where Material Science Research India Vol. 7(1), 179-186 (2010)

Evaluation of stresses in flame resistant materials