Boiling Heat Transfer Enhancement on Micro- and Nanoscales | Zendy

YURIY KUZMA-KICHTA | Zendy; A. V. Lavrikov | Zendy

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Boiling Heat Transfer Enhancement on Micro- and Nanoscales

Author(s) -

YURIY KUZMA-KICHTA,

A. V. Lavrikov

Publication year - 2019

Publication title -

destech transactions on environment energy and earth science

Language(s) - English

Resource type - Journals

ISSN - 2475-8833

DOI - 10.12783/dteees/tpcase2018/30408

Subject(s) - critical heat flux , materials science , micro heat exchanger , heat transfer , boiling , plate fin heat exchanger , microchannel , heat transfer enhancement , heat exchanger , high heat , heat flux , copper in heat exchangers , nucleate boiling , boiling heat transfer , electronics , heat spreader , electronics cooling , heat pipe , enhanced heat transfer , mechanics , mechanical engineering , plate heat exchanger , thermodynamics , nanotechnology , composite material , heat transfer coefficient , engineering , electrical engineering , physics

Microchannel heat exchangers for future electronics, air conditioning systems and heat pipes must provide an extremely high heat flux. Conventional heat transfer enhancement methods may not be applicable due to the small size of these heat exchangers. The present investigation is directed to solve problems of an effective cooling at high heat flux in microchannels and CHF increasing with help of an artificial nanorelief of the surface. The relief is formed by alumina nanoparticles which are deposited on the heating surface of the channel.

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