Open AccessStructures of Copper(II) Complexes Which Deposit Copper in Chemical Copper-plating Bath
Author(s) -
Seigo Ohno
Publication year - 1978
Publication title -
bulletin of the chemical society of japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.145
H-Index - 99
eISSN - 1348-0634
pISSN - 0009-2673
DOI - 10.1246/bcsj.51.3101
Subject(s) - copper , chemistry , platinum , copper plating , inorganic chemistry , formaldehyde , oxide , metallurgy , electroplating , catalysis , organic chemistry , layer (electronics) , materials science
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