
Chemical Mechanical Polishing for Surface Smoothing
Author(s) -
Markus Forsberg,
Jörgen Olsson
Publication year - 2002
Publication title -
physica scripta
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.415
H-Index - 83
eISSN - 1402-4896
pISSN - 0031-8949
DOI - 10.1238/physica.topical.101a00200
Subject(s) - chemical mechanical planarization , materials science , polishing , wafer , silicon , slurry , composite material , shallow trench isolation , optoelectronics , layer (electronics) , trench