z-logo
open-access-imgOpen Access
Electroless Deposition of Cu with Solutions Containing Either Mg2+ or Pd2+ Ions
Author(s) -
A. Mouroux,
Shi-Li Zhang,
Roger Palmans,
Woo Sig Min,
Karen Maex
Publication year - 1999
Publication title -
physica scripta
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.415
H-Index - 83
eISSN - 1402-4896
pISSN - 0031-8949
DOI - 10.1238/physica.topical.079a00232
Subject(s) - electrical resistivity and conductivity , materials science , tin , copper , impurity , deposition (geology) , aqueous solution , metallurgy , ion , electroless deposition , grain size , inorganic chemistry , analytical chemistry (journal) , chemistry , geology , chromatography , paleontology , organic chemistry , sediment , engineering , electrical engineering

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here