Influence of machining parameters on micro-motion platform displacement during grinding Al-Mg alloys workpiece assisted by two-dimensional low-frequency vibration
Author(s) -
Shiyang Yu,
Shijun Ji,
Ji Zhao,
Chao Zhang,
Handa Dai
Publication year - 2021
Publication title -
composites and advanced materials
Language(s) - English
Resource type - Journals
ISSN - 2634-9833
DOI - 10.1177/2633366x20985308
Subject(s) - machining , grinding , displacement (psychology) , vibration , voltage , radius , materials science , piezoelectricity , mechanical engineering , acoustics , ceramic , standard deviation , structural engineering , engineering , computer science , composite material , mathematics , physics , electrical engineering , psychology , computer security , psychotherapist , statistics
The main factors affecting the displacement of micro-motion platform during the grinding process are spindle speed, cutting force, and piezoelectric ceramic input voltage model. This article, using the orthogonal test method, found a set of machining parameters which lead to less displacement deviation between practical test and theoretic analysis. First of all, single-factor experiments were carried out to study how spindle speed, cutting force, and piezoelectric ceramic input voltage model affect the experimental results, and then the orthogonal test was conducted. The experimental datum shows that voltage model was the most influential factor, followed by spindle speed and cutting force. The optimum combination of grinding parameters was obtained as spindle speed of 800 r/min, cutting force of 18 N, and voltage model radius of 12 µm. At this time, the average unit error of displacement of micro-motion platform was 9.13%.
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