Open AccessCurability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive
Author(s) -
Chun-Fu Chen
Publication year - 2019
Publication title -
advances in materials
Language(s) - English
Resource type - Journals
eISSN - 2327-252X
pISSN - 2327-2503
DOI - 10.11648/j.am.20190802.16
Subject(s) - epoxy , adhesive , differential scanning calorimetry , materials science , composite material , isothermal process , thermal stability , epoxy adhesive , chemistry , thermodynamics , layer (electronics) , organic chemistry , physics
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