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Results of comprehensive studies into crystallographic texture of electrodeposited coppercoatings are presented in relation to their substructure, granular structure and surfacemorphology. Quantitative texture evaluation involving anisotropy of substructure characteristics,and determination of characteristics of substructure and granular structurein the axial and random components are addressed. Effects of texture anisotropy of substructureand texture nonhomogeneity of granular structure discovered in copper layers aredealt with. Influence of the deposition current density on quantitative characteristics oforiented structure in copper deposits is discussed. The effects of various thermodynamicfactors on texture formation in copper electroplates are considered for the stages of(i) nucleation and (ii) growth of grains in the major component of texture. Anisotropy ofshape is also treated for the elements of oriented structure in copper electrodeposits.

Texture of Electrodeposited Copper Coatings as Related to Their Substructure, Granular Structure and Surface Morphology