Description of Texture and Yield Locus Evolution Under Different Deformation Paths of Copper Sheet | Zendy

N. Míngolo | Zendy; Cristián Vial-Edwards | Zendy

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Description of Texture and Yield Locus Evolution Under Different Deformation Paths of Copper Sheet

Author(s) -

N. Míngolo,

Cristián Vial-Edwards

Publication year - 1995

Publication title -

texture stress and microstructure

Language(s) - English

Resource type - Journals

eISSN - 1687-5400

pISSN - 1687-5397

DOI - 10.1155/tsm.23.237

Subject(s) - viscoplasticity , materials science , copper , slip (aerodynamics) , texture (cosmology) , deformation (meteorology) , stress path , yield (engineering) , locus (genetics) , composite material , metallurgy , geometry , plasticity , mathematics , thermodynamics , physics , finite element method , computer science , constitutive equation , artificial intelligence , chemistry , image (mathematics) , biochemistry , gene

The evolution of texture with plastic deformation along different loading paths has been studied fora commercial DHP copper sheet metal. Two models have been utilized to predict the evolution oftextures: Viscoplastic under Relaxed Constraints conditions (VRC) and a Self Consistent approach (SC) with viscoplastic conditions, where the {111} active slip systems were selected according to a strain rate sensitivity law. The stress-strain curves along different loading paths were calculated taking into account the texture evolution predicted by VRC and SC models. Predictions with the SC formulation were very close to experimental results. Texture evolution depended on the deformation path.

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