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Quantitative Analysis of theMisorientation Distribution After theRecrystallisation of Tensile DeformedCopper Single Crystals
Author(s) -
F. Haeßner,
K. Sztwiertnia,
P.J. Wilbrandt
Publication year - 1991
Publication title -
texture stress and microstructure
Language(s) - English
Resource type - Journals
eISSN - 1687-5400
pISSN - 1687-5397
DOI - 10.1155/tsm.13.213
Subject(s) - misorientation , materials science , copper , metallurgy , ultimate tensile strength , crystallography , distribution (mathematics) , microstructure , mathematics , chemistry , mathematical analysis , grain boundary
Recrystallisation experiments in tensile deformed 〈100〉- and 〈111〉-oriented single crystals of high purity copper yielded very accurate information about the orientations of recrystallised grains and deformation microstructure. For a statistical evaluation of the orientation relationships between the dominant recrystallised grains and the deformation microstructure the misorientation distribution function was calculated. The most frequently occurring orientation relationships can be described by coincidence relationships. Always several coincidence relationships are needed to characterise the results. The specimen treatment strongly influences the occurrence of the individual coincidence orientation relationships. A particularly preferred growth of grains with a 30° or 40° 〈111〉 orientation relationship was not observed.

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