Reliability Considerations of Flip Chip Components for Automotive Electronic Applications | Zendy

Keisuke Sugiyama | Zendy; I. Bansaku | Zendy; Naoharu Tsuzimoto | Zendy; Iwao Tachikawa | Zendy

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Reliability Considerations of Flip Chip Components for Automotive Electronic Applications

Author(s) -

Keisuke Sugiyama,

I. Bansaku,

Naoharu Tsuzimoto,

Iwao Tachikawa

Publication year - 1981

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.9.87

Subject(s) - automotive industry , reliability (semiconductor) , electronics , flip chip , automotive electronics , automotive engineering , electronic component , electronic equipment , electronic systems , reliability engineering , chip , engineering , computer science , electrical engineering , manufacturing engineering , electronic engineering , materials science , nanotechnology , aerospace engineering , power (physics) , physics , adhesive , layer (electronics) , quantum mechanics

Electronic devices for automotive electronic applications have to be operated under extreme environmental conditions and therefore are required to have higher reliability compared with general electronic equipment. Recently automotive voltage regulators, ignition systems, etc. have been changing from mechanical constructions to electronic ones using thick film technology. This paper presents results that shows that our flip chip IC technology can satisfy the high reliability requirements of automobile electronics.

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