Open AccessGold Conductor Pastes for High Density Circuit
Author(s) -
Shiro Kadota,
Koshiro Shibata
Publication year - 1981
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/apec.9.31
Subject(s) - conductor , materials science , electrical engineering , composite material , engineering
High grade quality in fine-line printability, non-porosity of fired film and adhesion to substrate is required for gold conductor pastes applicable to multilayer or high density circuit. Many kinds of gold pastes were made by the changing of types and contents of main components such as gold powder, glass frit and organic vehicle. The important properties of the fired samples of the above pastes on alumina substrate and fired dielectric pastes were compared.
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