Open AccessPermanent Interconnection Technology Electronic Interconnections – the Printed Wiring Board
Author(s) -
I. G. Lang
Publication year - 1981
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/apec.9.139
Subject(s) - interconnection , printed circuit board , component (thermodynamics) , very large scale integration , electronic component , electronic systems , engineering , computer science , electrical engineering , electronic engineering , telecommunications , physics , thermodynamics
Modern manufacturing techniques which have been developed in respect of interconnection and packaging systems using printed circuit boards, are outlined. It is shown that these systems are capable of meeting present and future requirements for component mounting, including VLSI.
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