Three Dimensional Analytical Separation of Grain Boundary and Surface Scatterings in Polycrystalline Metal Films in the Case of Non Cubic Grains | Zendy

C. R. Tellier | Zendy; C. R. Pichard | Zendy; A. J. Tosser | Zendy

Open Access

Three Dimensional Analytical Separation of Grain Boundary and Surface Scatterings in Polycrystalline Metal Films in the Case of Non Cubic Grains

Author(s) -

C. R. Tellier,

C. R. Pichard,

A. J. Tosser

Publication year - 1980

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.9.125

Subject(s) - crystallite , grain boundary , materials science , metal , surface (topology) , condensed matter physics , separation (statistics) , metallurgy , geometry , physics , mathematics , microstructure , statistics

Analytical approximate expressions for the resistivity and its temperature coefficient of thin polycrystalline metal films have been derived by considering separately the contributions of the grain-boundaries perpendicular to the x-, y- and z-axes. Provided that the grain-boundaries act as moderately efficient scatterers reasonable deviations from the three-dimensional model are obtained; an approximate model then seems convenient with which to perform the calculations of the strain coefficients of such fine-grained films.

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