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Presented in this paper is a realization of Multi-Layer Substrate with 30 μm signal pattern width and 100 μm square via holes on a 100 mm square ceramic substrate. To obtain this fine signal pattern width, a thin film technique, “GSP” process, has been applied on a thick film dielectric layer. For the 100 μm square via holes through the thick film dielectric, a new thick film technique, “DD” process, has been developed utilizing a photolithographic technique. This paper describes the processes and the results obtained by the method.

Combination of Thick-Film Dielectric/Thin Film Conductor for Fine Pattern Formation of Multi-Layer Substrate