Solder Paste Process of Hybrid Circuits | Zendy

H. Takasago | Zendy; Kohei Adachi | Zendy; Youichiro Ohnishi | Zendy; Kazuo Tazuke | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

Solder Paste Process of Hybrid Circuits

Author(s) -

H. Takasago,

Kohei Adachi,

Youichiro Ohnishi,

Kazuo Tazuke

Publication year - 1981

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.8.21

Subject(s) - solder paste , soldering , materials science , flip chip , printed circuit board , reliability (semiconductor) , process (computing) , substrate (aquarium) , electronic circuit , chip , screen printing , metallurgy , composite material , computer science , engineering , electrical engineering , adhesive , layer (electronics) , power (physics) , physics , oceanography , quantum mechanics , geology , operating system

This paper describes the critical factors required for the solder paste process and its applications to Hybrid Circuits (Solder Paste Process). It also describes the fine solder printing of substrate pads for flip chip IC and the simultaneously thick printing of solder paste for chip capacitors and/or other parts. Through this “Solder Paste Process”, assemblies of good quality and higher yields are achieved. The results of various evaluation and reliability tests were excellent. From this study, some new applications of solder paste are presented.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research