Open AccessCopper Materials System for Microcircuitry: A Status Report
Author(s) -
J. D. Mitchell,
P.C. Donohue,
C.R.S. Needes,
Rolf E. Funer,
R. Uhler
Publication year - 1981
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/apec.8.145
Subject(s) - copper , environmental science , materials science , metallurgy
The electronics industry has become interested in a thick film materials system based on copper for both technical and economic reasons. Copper conductors offer excellent conductivity, solderability, and solder leach resistance as well as lower intrinsic metal cost and price stability.
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