Properties of Nickel Films Prepared by R.F. Sputtering and Interdiffusion Analysis of Ta2N–Ni Films | Zendy

Syed Zain Ul Abdin | Zendy; A. M. Huber | Zendy; G. Morillot | Zendy; C. Val | Zendy

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Properties of Nickel Films Prepared by R.F. Sputtering and Interdiffusion Analysis of Ta₂N–Ni Films

Author(s) -

Syed Zain Ul Abdin,

A. M. Huber,

G. Morillot,

C. Val

Publication year - 1980

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.7.159

Subject(s) - sputtering , nickel , materials science , layer (electronics) , analytical chemistry (journal) , deposition (geology) , tantalum , secondary ion mass spectrometry , etching (microfabrication) , secondary ion mass spectroscopy , metallurgy , mass spectrometry , thin film , chemistry , composite material , silicon , nanotechnology , chromatography , paleontology , sediment , biology

Ni film deposition by r.f. sputtering and etching conditions have been investigated. The contact resistance and adhesion of this Ni layer deposited directly onto Ta 2 N films have also been studied in air and at elevated temperatures. In this combination, the Ta 2 N/Ni interdiffusion analysis was carried out by the Secondary Ion Mass Spectroscopy (SIMS).

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