Open AccessSintering Mechanisms in Base Metal Conductors
Author(s) -
J. Degraeuwe,
E. Brauns,
R. Van Overstraeten,
J.R. Roos,
René Govaerts
Publication year - 1980
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/apec.7.113
Subject(s) - materials science , electrical conductor , sintering , microstructure , grain size , metal , composite material , base (topology) , grain growth , metallurgy , sheet resistance , copper , mathematical analysis , mathematics , layer (electronics)
Thick film conductors based on Al, Cu and Ni have been studied. Because of its high depth of field, a SEM was used to study the microstructures of the fired conductors.
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