Open AccessAn Improved Thick Film Aluminium Conductor Process
Author(s) -
R. E. Cooper,
P.F.T. Linford,
Jessica A. Savage
Publication year - 1980
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/apec.6.253
Subject(s) - aluminium , conductor , materials science , process (computing) , metallurgy , composite material , computer science , operating system
Aluminium thick film conductors offer very large cost advantages compared with noble metals and can also improve the reliability of circuits by eliminating gold-aluminium interfaces and their attendant intermetallic phenomena. To date however, it has not been possible to produce aluminium thick film conductors which are ultrasonically bondable to aluminium-silicon wire.
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