Open AccessSilicone Resin and Elastomer Protection of Hybrid Circuits
Author(s) -
B. R. Trego
Publication year - 1980
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/apec.6.127
Subject(s) - silicone , elastomer , materials science , composite material , curing (chemistry) , silicone elastomers , humidity , physics , thermodynamics
Developments in encapsulants, in particular in relation to stress and humidity protection, are examined. Superior protection can now be achieved with flexible room temperature curing silicone encapsulants.
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