Hybrid Realisation of High Precision Analog Conversion Modules | Zendy

Liu Hua Kun | Zendy

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Hybrid Realisation of High Precision Analog Conversion Modules

Author(s) -

Liu Hua Kun

Publication year - 1978

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.5.49

Subject(s) - realisation , interconnection , amplifier , electronic engineering , yield (engineering) , stability (learning theory) , electronic circuit , voltage , operational amplifier , engineering , computer science , electrical engineering , materials science , cmos , telecommunications , physics , quantum mechanics , machine learning , metallurgy

High precision analog modules are manufactured using film technologies. Components which are critical as regards operation and stability are made by thin film technology, additional elements and interconnection of active components are made using thick film technology. Using these two separate manufacturing methods to obtain high stability and accuracy, optimum cost and yield can be achieved. To illustrate these facts, two circuits are discussed in detail, a voltage to frequency converter and a log amplifier.

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