The Effect of Thin Film Deposition Angle andSubstrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder | Zendy

L. J. Rickabaugh | Zendy

Open Access

The Effect of Thin Film Deposition Angle andSubstrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb Solder

Author(s) -

L. J. Rickabaugh

Publication year - 1977

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.4.43

Subject(s) - materials science , dissolution , thin film , texture (cosmology) , surface roughness , deposition (geology) , ceramic , surface finish , substrate (aquarium) , composite material , metallurgy , chemical engineering , nanotechnology , paleontology , oceanography , sediment , geology , engineering , artificial intelligence , computer science , image (mathematics) , biology

Thin film conductor dissolution rates in 60% Sn 40% Pb solder have been shown to be related to substrate surface texture. This paper summarizes work to show that "shadowing" phenomenon resulting from a combination of ceramic substrate surface texture and film deposition angle causes film "islands" which influence the dissolution process. These islands, more predominant in thin evaporated films than sputtered films, dissolve rapidly since their dissolution occurs from the sides as well as the top surface. The use ofboth glass and ceramic substrates (smooth and rough surface texture respectively), several film deposition angles, and composite film depositions indicate that thin film dissolution in

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