Economics of Thick and Thin Film Hybrid Production in Europe | Zendy

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Economics of Thick and Thin Film Hybrid Production in Europe

Author(s) -

David Boswell,

David Campbell

Publication year - 1977

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.4.219

Subject(s) - microelectronics , interconnection , electronic circuit , integrated circuit , production (economics) , hybrid system , engineering physics , materials science , industrial organization , electrical engineering , manufacturing engineering , engineering , telecommunications , computer science , economics , microeconomics , machine learning

This paper is a report of a discussion panel held at the First European Conference on Hybrid Microelectronics, concerning the Economics of Hybrid Production. Figures were presented at the discussion showing the sizes of the markets in the U.S.A. and in Europe, demonstrating the percentage of total hybrid markets associated with thin film technology and also the percentage of the market associated with hermetically packaged circuits. It was shown that the growth rate in hybrid technology is similar to that predicted for integrated circuits, a result which can be explained in terms of the interconnection facility which hybrid technology offers.

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