Remarks on Wire and Die Bonding for Hybrid Circuits | Zendy

A. Soffa | Zendy

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Remarks on Wire and Die Bonding for Hybrid Circuits

Author(s) -

A. Soffa

Publication year - 1977

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.4.157

Subject(s) - microprocessor , die (integrated circuit) , flexibility (engineering) , wire bonding , electronic circuit , computer science , ball (mathematics) , chip , computer hardware , integrated circuit , engineering drawing , embedded system , engineering , electrical engineering , telecommunications , operating system , mathematics , mathematical analysis , statistics

Advances in hybrid automatic wire bonding include refined joy stick techniques, automatic alignment, a digitally operated head for higher speeds and flexibility, missing ball detection and programming aids. Advanced hybrid die attach equipment will have to accept a large variety of chip presentation techniques but will use CCTV and automatic alignment with microprocessor controls to aid programming and speed output.

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