Improved Hybrid Circuit Assembly Yields and Reliability byGlassivation of the Semiconductor Chip | Zendy

B. C. Heap | Zendy; S. A. France | Zendy

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Improved Hybrid Circuit Assembly Yields and Reliability byGlassivation of the Semiconductor Chip

Author(s) -

B. C. Heap,

S. A. France

Publication year - 1977

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.4.117

Subject(s) - passivation , transistor , materials science , chip , semiconductor , robustness (evolution) , optoelectronics , reliability (semiconductor) , ceramic , electronic engineering , nanotechnology , electrical engineering , engineering , composite material , chemistry , voltage , physics , layer (electronics) , quantum mechanics , gene , biochemistry , power (physics)

Lead glass passivation (glassivation) of semiconductor chips has been investigated. Glassivation of BC107 type transistor chips has resulted in improved robustness and their ability to withstand ionic contamination better than control chips. Increased yields were observed when glassivated transistor chips were assembled in ceramic flat packages.

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