Field Assisted Glass Sealing | Zendy

George Wallis | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

Field Assisted Glass Sealing

Author(s) -

George Wallis

Publication year - 1975

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.2.45

Subject(s) - seal (emblem) , strain gauge , process (computing) , field (mathematics) , mechanical engineering , work (physics) , forensic engineering , materials science , engineering physics , composite material , engineering , computer science , archaeology , mathematics , history , pure mathematics , operating system

The paper reviews the experimental, theoretical and applications work by several authors on a glass sealing technique which was announced five years ago. In the process, an electrostatic field is utilized to promote bonding at relatively low temperatures. The process variables and seal properties are described in detail. A discussion is presented of the mechanisms which are believed to play a role in bond formation. As an example of the utility of the technique, its highly successful application to the mounting of strain gauges is described.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research