The Direct Bonding of Metals to Ceramics and Application in Electronics | Zendy

James Burgess | Zendy; C. A. Neugebauer | Zendy; George Flanagan | Zendy; Robert E. Moore | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

The Direct Bonding of Metals to Ceramics and Application in Electronics

Author(s) -

James Burgess,

C. A. Neugebauer,

George Flanagan,

Robert E. Moore

Publication year - 1975

Publication title -

active and passive electronic components

Language(s) - English

Resource type - Journals

eISSN - 1026-7034

pISSN - 0882-7516

DOI - 10.1155/apec.2.233

Subject(s) - materials science , eutectic system , ceramic , direct bonding , eutectic bonding , oxidizing agent , copper , metallurgy , metallic bonding , melting point , metal , anodic bonding , foil method , composite material , alloy , chemistry , silicon , organic chemistry

The direct bonding of metals to ceramics is possible utilizing a gas metal eutectic. The mechanism of direct bonding of copper foil to ceramics in a slightly oxidizing atmosphere is presented. It involves the formation of eutectic melt between copper and oxygen at a temperature slightly below the melting point of copper, which serves to bring the foil into intimate contact with the substrate. Metals to which technique is applicable include Cu, Fe, Ni, Co, Ag, Cr, Mo and Al. A brief review of other metal–ceramic bonding techniques is given for comparison.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research